Corvus - CPU/GPU LN2 Container

PREMIUM BUNDLE

• 1 × Copper Base –  ø77.65 × 57.5 mm / 1640 g – T2 Copper glas bead blasted
• 1 × Aluminium Tube – ø80 × 2 mm × 150 mm - EN AW 6060
• 1 × Rubber insulation  – ø80 × 13 mm × 150 mm
• 1 × Rubber insulation – 200 × 200 × 25 mm 
• 1 × CPU Mount – 7.5 mm – EN AW 6060 

          Intel: S478 / S775 / S115x / S1200 / S1366 / S1700 / S1851 / S20xx / S3647
          AMD: S754 / S939 / FM1 / FM2 / AM2 / AM3 / AM4 / AM5
          Universal: 65×65 – 90×90 mm 

• 1 × GPU Mount – 3.0 mm – SS304 / 1.4301 

          43 × 43 mm, 52×52 – 63×63 mm

• 4 × Medium Springs –  3 × 15 mm – 20.28 N/mm
• 4 × Medium Springs –  4 × 25 mm – 17.01 N/mm
• 4 ×  M2.5 knurled nuts – Brass 
• 4 ×  M3 knurled nuts – CS/NP  
• 4 ×  M4 knurled nuts – Brass 
• 4 ×  M2.5 threaded rod – M2.5 × 50 mm  – A2 
• 4 ×  M4 threaded rod – M4 × 200 mm  – A2  
• 4 ×  M2.5 DIN 912 – M2.5 × 6 mm –CS 12.9 
• 4 ×  M3 DIN 912 – M3 × 45 mm –A2
• 1 ×  3D printed storage container 

CPU ONLY BUNDLE

• 1 × Copper Base –  ø77.65 × 57.5 mm / 1640 g – T2 Copper glas bead blasted
• 1 × Aluminium Tube – ø80 × 2 mm × 150 mm - EN AW 6060
• 1 × Rubber insulation  – ø80 × 13 mm × 150 mm
• 1 × Rubber insulation – 200 × 200 × 25 mm 
• 1 × CPU Mount – 7.5 mm – EN AW 6060 

          Intel: S478 / S775 / S115x / S1200 / S1366 / S1700 / S1851 / S20xx / S3647
          AMD: S754 / S939 / FM1 / FM2 / AM2 / AM3 / AM4 / AM5
          Universal: 65×65 – 90×90 mm 

• 4 × Medium Springs –  4 × 25 mm – 17.01 N/mm
• 4 ×  M4 knurled nuts – Brass 
• 4 ×  M4 threaded rod – M4 × 200 mm  – A2 
• 1 ×  3D printed storage container 

ECO BUNDLE

• 1 × Copper Base –  ø77.65 × 57.5 mm / 1640 g – T2 Copper glas bead blasted 
• 1 × Aluminium Tube – ø80 × 2 mm × 150 mm - EN AW 6060

The LN₂ Cooling Pot is a high-performance liquid nitrogen cooling solution engineered for extreme CPU and GPU overclocking. Featuring a precision-machined, high thermal mass copper base combined with a lightweight aluminium tube, it delivers fast temperature response and stable subzero operation under LN₂. Designed for open-air test benches, the pot supports a wide range of modern CPU sockets and GPU mounting configurations, making it ideal for competitive benchmarking, hardware validation, and professional overclocking applications. Its robust construction and optimized internal geometry ensure reliable, repeatable cooling performance even on power-hungry platforms. 

The pot base is glass bead blasted to increase surface area and cooling capacity. Due to the nature of this process, the contact area cannot be excluded. For best results, it is recommended to sand or lap the contact surface to achieve a smooth finish.

To minimize oxidation, thoroughly dry all components after use and apply Ballistol oil or a similar protective product.